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品牌是'Xilinx' (1945)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 供应商器件包装 | 质量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终端 | 温度系数 | 类型 | 电阻 | 应用 | 性别 | 电容量 | 子类别 | 额定功率 | 技术 | 方向 | 屏蔽/屏蔽 | 频率 | 终端样式 | 接头数量 | 工作电源电压 | 引线间距 | 铅直径 | 电压 | 电感,电感 | 测试频率 | 负载电容 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 驱动电平 | 产品类别 | 工作温度范围 | 等效串联电阻 | 消耗功率 | 主要属性 | 芯类型 | 闪光大小 | 产品 | 饱和电流 | 特征 | 产品类别 | 直径 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||
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 | XCZU25DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Flanges | Compliant | Bulk | * | 活跃 | Crimp | Female | Straight | 18 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FFVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 17.3 kg | AMD 赛灵思 | Tray | 活跃 | Compliant | 561 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1.6 kW | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FFVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Non-Compliant | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU25DR-L2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Molex | Bulk | 075577 | 活跃 | Tray | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU28DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TE Connectivity Deutsch 连接器 | Bag | AFD57 | 活跃 | Tray | MIL-DTL-26482 G Series II, AFD | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FSVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 561 | 活跃 | 0°C ~ 100°C (TJ) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L1FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, Ground Lug | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | BARKER MICROFARADS INC | Y | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | ECE/EXCEL CELL ELECTRONIC CORP | Y | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 101.5mm (3.996 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | BARKER MICROFARADS INC | Y | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Y | ECE/EXCEL CELL ELECTRONIC CORP | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 106.5mm (4.193 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FSVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Bracket | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-L1FFVF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, no accessories | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 622 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Stud Can | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Combos: 2, 3 or 4, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Y | BARKER MICROFARADS INC | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Term: ¼in Solder Lug Quick-Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 366 | 活跃 | Y | BARKER MICROFARADS INC | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM2502-1LSEVSVC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 155 C | 0.000071 oz | - 55 C | 1000 | PCB 安装 | 6-1879134-0 | TE Connectivity | TE Connectivity / Holsworthy | Details | 100 V | 0603 | 1608 | MouseReel | RN73 | 0.1 % | 10 PPM / C | 贴片大功率精密电阻器 | 41.2 kOhms | Resistors | 62.5 mW (1/16 W) | Thin Film | SMD/SMT | 700 mV | 薄膜电阻器 | - 55 C to + 155 C | 精密薄膜贴片电阻器 | - | Thin Film Resistors - SMD | 0.45 mm | 1.55 mm | 0.8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE2202-1MSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5 mm x 3.2 mm | + 60 C | 0.001764 oz | - 10 C | 1000 | SMD/SMT | CTS | CTS电子元件 | Details | MouseReel | 445 | 30 PPM | SMD石英 | Crystals | 24.576 MHz | SMD/SMT | 800 mV | 12 pF | 100 uW | Crystals | 40 Ohms | Crystals | 1.35 mm | 5 mm | 3.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE2002-1MSESFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 100 | Cornell Dubilier | Cornell Dubilier - CDE | Details | + 100 C | 0 C | Bulk | 381LR | 220 uF | Capacitors | 800 mV | 电解电容器 | Aluminum Electrolytic Capacitors - Snap In | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE2202-1LLISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | PCB 安装 | Bourns | J.W. Miller | 5 mOhms | Details | 24.3 A | + 200 C | 1.404962 oz | - 55 C | 50 | Tray | 2300HT | 15 % | Standard | Toroidal | 大电流 | Inductors, Chokes & Coils | Unshielded | Radial | 700 mV | 0.56 in | 0.066 in | 8.2 uH | 1 kHz | 固定电感器 | Toroidal | 功率感应器 | Power Inductors - Leaded | 32.512 mm | 16.51 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE2102-1MSISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 35 VDC | EPCOS / TDK | Details | + 85 C | 0.091712 oz | - 40 C | 1500 | B41821A7687M000 | EPCOS / TDK | Bulk | B41821 | 20 % | 680 uF | Capacitors | Radial | 800 mV | 电解电容器 | Aluminum Electrolytic Capacitors - Radial Leaded | 10 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVP1502-1LLIVSVA2785-ES9780 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TT Electronics | BI Technologies / TT Electronics | 43 mOhms | 4.1 A | AEC-Q200 | + 155 C | - 40 C | 500 | PCB 安装 | Reel | HA78 | 20 % | Standard | Wirewound | Inductors, Chokes & Coils | Shielded | SMD/SMT | 700 mV | 22 uH | 1 kHz | 固定电感器 | 功率感应器 | 3.6 A | Power Inductors - SMD | 8 mm | 12.5 mm | 12.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE2302-1MLISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XQVC1902-2HSIVSQA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Non-Compliant | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA |
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XCZU25DR-L2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-2FFVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-2FFVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU25DR-L2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU28DR-L1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-1FSVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-L1FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-1FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-L1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-1FSVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-L1FFVF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM2502-1LSEVSVC2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVE2202-1MSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVE2002-1MSESFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVE2202-1LLISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVE2102-1MSISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVP1502-1LLIVSVA2785-ES9780
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVE2302-1MLISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
-
XQVC1902-2HSIVSQA2197
Xilinx
分类:Embedded - System On Chip (SoC)