Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	供应商器件包装								厂商								操作温度	系列	温度系数	电阻	子类别	额定功率	电阻器类型	工作电源电压	速度	内存大小	核心处理器	周边设备	连接方式	建筑学	产品类别
XCVE2002-2HSISFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	- 40 C	1	Xilinx	Xilinx							SOC - Systems on a Chip	250 mW	Industrial	880 mV							System-On-Modules - SOM	1				SoC FPGA
XCVE2302-2LSESFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	0 C	1	Xilinx	Xilinx					100.0000 ppm/°C	15.4 MOhm	SOC - Systems on a Chip	0.5 W	Industrial	700 mV							System-On-Modules - SOM	1				SoC FPGA	2.29	6.1
XQVP1202-1LLIVSQA2785	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1				AEC-Q200	+ 110 C	- 40 C	1	Xilinx	Xilinx			100 ppm/K	330 kOhm	SOC - Systems on a Chip	1 W	通用型	700 mV							System-On-Modules - SOM	1				SoC FPGA	6.3 mm	3.15 mm
XQVC1802-1LLIVIQA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	- 40 C	1	Xilinx	Xilinx					50.0000 ppm/°C	137 kOhm	SOC - Systems on a Chip	0.5 W	Industrial	700 mV							System-On-Modules - SOM	1				SoC FPGA	6.1
XCVM1302-2LSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	活跃	316	Tray	0°C ~ 100°C (TJ)	Versal™ Prime							450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 70k Logic Cells		-
XCZU43DR-2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃	366	Tray	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC							533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCVM1802-1LLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	726	Tray	-40°C ~ 100°C (TJ)	Versal™ Prime							400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVM1802-1LSIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	726	Tray	-40°C ~ 100°C (TJ)	Versal™ Prime							400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVM1802-1LSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	活跃	770	Tray	0°C ~ 100°C (TJ)	Versal™ Prime							400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVC1802-2LLEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	692	Tray	0°C ~ 100°C (TJ)	Versal™ AI Core							450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVC1802-2LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	692	活跃	0°C ~ 100°C (TJ)								450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCZU47DR-1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃	561	Tray	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC							500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU46DR-L1FFVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思	活跃	574	Tray	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC							500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCVC1902-1LSIVIVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD 赛灵思	活跃	500	Tray	-40°C ~ 100°C (TJ)	Versal™ AI Core							400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.9M Logic Cells		-
XCZU2EG-L2UBVA530E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	103320 LE	+ 110 C	0 C	AMD 赛灵思	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB	82	Tray	活跃	2 x 32 kB, 4 x 32 kB	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG						850 mV	533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	7 Core	-
XCZU3EG-L1UBVA530I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	154350 LE	+ 100 C	- 40 C	AMD 赛灵思	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB	82	Tray	活跃	2 x 32 kB, 4 x 32 kB	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG						850 mV	500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	7 Core	-
XCZU3EG-L2UBVA530E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	154350 LE	+ 110 C	0 C	AMD 赛灵思	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB	82	Tray	活跃	2 x 32 kB, 4 x 32 kB	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG						850 mV	533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	7 Core	-
XCVM1802-1MSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	770	活跃	0°C ~ 100°C (TJ)								600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVM1802-2MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	726	Tray	0°C ~ 100°C (TJ)	Versal™ Prime							600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVM1802-2MLEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	活跃	770	Tray	0°C ~ 100°C (TJ)	Versal™ Prime							600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVC1902-1MSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	活跃	770	Tray	-40°C ~ 100°C (TJ)	Versal™ AI Core							600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.9M Logic Cells		-
XCVC1802-2MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	692	Tray	0°C ~ 100°C (TJ)	Versal™ AI Core							600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVC1802-1MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	692	Tray	0°C ~ 100°C (TJ)	Versal™ AI Core							600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVC1802-2MLIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	活跃	770	Tray	-40°C ~ 100°C (TJ)	Versal™ AI Core							600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVC1802-2MLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	活跃	692	Tray	-40°C ~ 100°C (TJ)	Versal™ AI Core							600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-