Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	资历状况	工作电源电压	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	传播延迟	连接方式	接通延迟时间	建筑学	数据总线宽度	核心架构	边界扫描	内存(字)	主要属性	寄存器数量	可擦除紫外线	座位高度(最大)	长度	宽度	RoHS状态
XCZU4EV-L1SFVC784I	Xilinx Inc.	数据表	486 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B784		0.742V	0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XC7Z007S-2CLG225E	Xilinx Inc.	数据表	944 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		225-LFBGA, CSPBGA	YES		54		0°C~100°C TJ	Tray	2016	Zynq®-7000	e1	yes	活跃	3 (168 Hours)	225		Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM	BALL	260	1V	0.8mm		30	S-PBGA-B225		1.05V	0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			YES	256000	Artix™-7 FPGA, 23K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.5mm	13mm	13mm	ROHS3 Compliant
XC7Z012S-1CLG485C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		484-LFBGA, CSPBGA	YES		150		0°C~85°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	485		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明	S-PBGA-B485		1.05V	0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			YES	256000	Artix™-7 FPGA, 55K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	19mm	19mm	ROHS3 Compliant
XC7Z010-L1CLG225I	Xilinx Inc.	数据表	769 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	225-LFBGA, CSPBGA		86		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	225	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	667MHz	30	S-PBGA-B225	1V	1.05V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32b	ARM	YES	256000	Artix™-7 FPGA, 28K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.5mm	13mm		ROHS3 Compliant
XCZU4CG-2SFVC784E	Xilinx Inc.	数据表	957 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XA7Z010-1CLG400I	Xilinx Inc.	数据表	205 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks			400-LFBGA, CSPBGA	YES	400	130	Automotive grade	-40°C~100°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	4 (72 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明		0.8mm	667MHz	未说明	不合格		11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32b	ARM			Artix™-7 FPGA, 28K Logic Cells		N	1.6mm	17mm		ROHS3 Compliant
XCZU4EV-2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XA7Z010-1CLG400Q	Xilinx Inc.	数据表	810 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA		400	130	Automotive grade	-40°C~125°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	4 (72 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明		0.8mm	667MHz	未说明	不合格	1V	11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32b	ARM			Artix™-7 FPGA, 28K Logic Cells		N	1.6mm	17mm		ROHS3 Compliant
XC7Z030-1FB484I	Xilinx Inc.	数据表	878 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BBGA, FCBGA	YES		130		-40°C~100°C TJ	Bulk	2009	Zynq®-7000		no	活跃	2A (4 Weeks)	484			GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01	BOTTOM	BALL						S-PBGA-B484							667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			YES	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN, ETHERNET, I2C, PCI, SPI, UART, USB				ROHS3 Compliant
XCZU4EG-L2SFVC784E	Xilinx Inc.	数据表	248 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B784		0.742V	0.698V				533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU5EG-2SFVC784I	Xilinx Inc.	数据表	817 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XC7Z100-L2FFG900I	Xilinx Inc.	数据表	990 In Stock	1: ¥2,172.987694 10: ¥2,101.535487 25: ¥2,086.926998 50: ¥2,072.420058 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA	900	130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30					CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	120 ps	MCU, FPGA		ARM	YES	256000	Kintex™-7 FPGA, 444K Logic Cells	554800	CAN; ETHERNET; I2C; SPI; UART; USB	3.35mm	31mm	31mm	ROHS3 Compliant
XCZU5EG-1SFVC784I	Xilinx Inc.	数据表	303 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XC7Z014S-2CLG484I	Xilinx Inc.	数据表	785 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		484-LFBGA, CSPBGA	YES		200		-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	484		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明	S-PBGA-B484		1.05V	0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			YES	256000	Artix™-7 FPGA, 65K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	19mm	19mm	ROHS3 Compliant
XCZU7EG-3FFVC1156E	Xilinx Inc.	数据表	212 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			360		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU9CG-1FFVB1156I	Xilinx Inc.	数据表	478 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			328		-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU15EG-2FFVC900I	Xilinx Inc.	数据表	81 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 747K+ Logic Cells						ROHS3 Compliant
XCZU2EG-1SFVA625E	Xilinx Inc.	数据表	191 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA			180		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU2EG-L1SFVC784I	Xilinx Inc.	数据表	326 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B784		0.742V	0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU7EV-1FBVB900I	Xilinx Inc.	数据表	584 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU3EG-1SFVC784E	Xilinx Inc.	数据表	183 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU9EG-L1FFVB1156I	Xilinx Inc.	数据表	214 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA	YES		328		-40°C~100°C TJ	Bulk	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B1156		0.742V	0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU3CG-L1SFVC784I	Xilinx Inc.	数据表	152 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	S-PBGA-B784							500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU15EG-2FFVB1156E	Xilinx Inc.	数据表	549 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			328		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					Zynq®UltraScale+™ FPGA, 747K+ Logic Cells						ROHS3 Compliant
XC7Z014S-2CLG400E	Xilinx Inc.	数据表	208 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		400-LFBGA, CSPBGA	YES		125		0°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明	S-PBGA-B400		1.05V	0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			YES	256000	Artix™-7 FPGA, 65K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	17mm	17mm	ROHS3 Compliant