Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	传播延迟	连接方式	接通延迟时间	建筑学	数据总线宽度	核心架构	最高频率	边界扫描	内存(字)	主要属性	寄存器数量	总线兼容性	座位高度(最大)	长度	宽度	RoHS状态
XCZU15EG-1FFVB1156E	Xilinx Inc.	数据表	849 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				328		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 747K+ Logic Cells						ROHS3 Compliant
XCZU2EG-1SBVA484I	Xilinx Inc.	数据表	798 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA				82		-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XC7Z045-2FF676I	Xilinx Inc.	数据表	623 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks			676-BBGA, FCBGA	YES			ROMless	130	-40°C~100°C TJ	Tray	2010	Zynq®-7000		no	活跃	4 (72 Hours)	676						8542.39.00.01	BOTTOM	BALL				800MHz		S-PBGA-B676			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32b	ARM		YES	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN, ETHERNET, I2C, PCI, SPI, UART, USB				Non-RoHS Compliant
XC7Z100-1FF900I	Xilinx Inc.	数据表	588 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		900-BBGA, FCBGA			900-FCBGA (31x31)	130		-40°C~100°C TJ	Tray	2010	Zynq®-7000			活跃	4 (72 Hours)				100°C	-40°C								667MHz					CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB			667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32b	ARM	667MHz			Kintex™-7 FPGA, 444K Logic Cells						Non-RoHS Compliant
XCZU9CG-2FFVB1156I	Xilinx Inc.	数据表	59 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				328		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)																					533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU19EG-2FFVC1760E	Xilinx Inc.	数据表	430 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1760-BBGA, FCBGA				512		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells						ROHS3 Compliant
XCZU5EV-1SFVC784E	Xilinx Inc.	数据表	997 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			784-FCBGA (23x23)	252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)																					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU5CG-2SFVC784E	Xilinx Inc.	数据表	785 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA				252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU3EG-2SFVA625I	Xilinx Inc.	数据表	617 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA	YES			180		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625						8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明	R-PBGA-B625	0.876V	0.825V				533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XC7Z045-L2FBG676I	Xilinx Inc.	数据表	877 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		676-BBGA, FCBGA	YES			130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明	S-PBGA-B676	1.05V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		ARM		YES	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	2.54mm	27mm	27mm	ROHS3 Compliant
XC7Z035-2FBG676E	Xilinx Inc.	数据表	36 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		676-BBGA, FCBGA	YES			130		0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明	S-PBGA-B676	1.05V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		ARM		YES	256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	2.54mm	27mm	27mm	ROHS3 Compliant
XCZU9EG-3FFVB1156E	Xilinx Inc.	数据表	989 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				328		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU11EG-1FFVC1156E	Xilinx Inc.	数据表	67 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				360		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
XCZU6CG-2FFVC900I	Xilinx Inc.	数据表	362 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA	YES			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900						8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明	R-PBGA-B900	0.876V	0.825V				533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU2CG-2SBVA484E	Xilinx Inc.	数据表	559 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA				82		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU3EG-2SFVC784E	Xilinx Inc.	数据表	810 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA				252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU3EG-1SFVA625I	Xilinx Inc.	数据表	261 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA				180		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU6EG-L1FFVC900I	Xilinx Inc.	数据表	758 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA	YES			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B900	0.742V	0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU7EV-1FBVB900E	Xilinx Inc.	数据表	242 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA				204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU5EV-2SFVC784E	Xilinx Inc.	数据表	581 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA				252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU2EG-1SFVA625I	Xilinx Inc.	数据表	480 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA				180		-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU19EG-2FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks		1517-BBGA, FCBGA				644		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells						ROHS3 Compliant
XCZU2CG-1SFVA625E	Xilinx Inc.	数据表	159 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA				180		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	e1		活跃	4 (72 Hours)			Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.31.00.01			未说明				未说明							500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XC7Z100-L2FFG1156I	Xilinx Inc.	数据表	791 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	1156-BBGA, FCBGA	1156		130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)		3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	120 ps	MCU, FPGA		ARM		YES	256000	Kintex™-7 FPGA, 444K Logic Cells	554800	CAN; ETHERNET; I2C; SPI; UART; USB	3.1mm	35mm	35mm	ROHS3 Compliant
XCZU5CG-L2SFVC784E	Xilinx Inc.	数据表	717 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784					IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL		0.72V				S-PBGA-B784						533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant