3M Interconnect Solutions 6850/BJCJC

表面安装

NO

终端数量

24

Manufacturer Part Number

6850/BJCJC

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP24,.6

Risk Rank

5.92

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP24,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

5 V

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5 V

筛选水平

38535Q/M;38534H;883B