3M Interconnect Solutions MDT10P22A2K

表面安装

NO

终端数量

22

ROM(word)

1024

RAM(byte)

72

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP22,.3

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.84

Package Description

DIP, DIP22,.3

Ihs Manufacturer

MICON DESIGN TECHNOLOGY CORP

Part Life Cycle Code

Obsolete

Manufacturer Part Number

MDT10P22A2K

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T22

资历状况

不合格

电源

2.5/5 V

速度

20 MHz

位元大小

8

只读存储器可编程性

UVPROM