Allegro MicroSystems ULS2023R883

表面安装

NO

终端数量

16

晶体管元件材料

SILICON

Manufacturer Part Number

ULS2023R883

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ALLEGRO MICROSYSTEMS LLC

Part Package Code

DIP

Package Description

HERMETIC SEALED, CERAMIC, DIP-16

Risk Rank

5.89

Number of Elements

7

Package Body Material

CERAMIC, GLASS-SEALED

Package Shape

RECTANGULAR

Package Style

IN-LINE

ECCN 代码

EAR99

附加功能

HIGH RELIABILITY

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-GDIP-T16

资历状况

不合格

配置

COMPLEX

晶体管应用

SWITCHING

极性/通道类型

NPN

集电极电流-最大值(IC)

0.5 A

集电极-发射器电压-最大值

95 V