ALTERA EP2AGX65DF29

表面安装

YES

终端数量

780

Ihs Manufacturer

INTEL CORP

Manufacturer

Intel Corporation

Manufacturer Part Number

EP2AGX65DF29

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Description

BGA,

Package Shape

SQUARE

Package Style

网格排列

Part Life Cycle Code

活跃

Risk Rank

5.56

Supply Voltage-Max

0.93 V

Supply Voltage-Min

0.87 V

Supply Voltage-Nom

0.9 V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B780

座位高度-最大

2.7 mm

可编程逻辑类型

现场可编程门阵列

长度

29 mm

宽度

29 mm