AMD 215TQA6AVA12FG

表面安装

YES

终端数量

465

Manufacturer Part Number

215TQA6AVA12FG

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Part Package Code

BGA

Package Description

,

Risk Rank

5.84

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

Reach合规守则

unknown

引脚数量

465

JESD-30代码

S-PBGA-B465

资历状况

不合格

uPs/uCs/外围ICs类型

MICROPROCESSOR