AMD 53LS141J

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Number of Words Code

256

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

53LS141J

Number of Words

256 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Monolithic Memories

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MONOLITHIC MEMORIES

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

OTP ROM

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

MILITARY

组织结构

256X4

内存宽度

4

记忆密度

1024 bit

内存IC类型

OTP ROM