AMD 5962-8766104XA

表面安装

NO

终端数量

28

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

16000

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Access Time-Max

170 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

5962-8766104XA

Number of Words

16384 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Defense Supply Center Columbus

Part Life Cycle Code

活跃

Ihs Manufacturer

DEFENSE SUPPLY CENTER COLUMBUS

Risk Rank

5.52

Part Package Code

DIP

Usage Level

Military grade

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

锡铅

HTS代码

8542.32.00.61

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

引脚数量

28

JESD-30代码

R-GDIP-T28

资历状况

Qualified

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

16KX8

内存宽度

8

记忆密度

131072 bit

筛选水平

MIL-STD-883

并行/串行

PARALLEL

内存IC类型

UVPROM