AMD 5962-9957201QZX

表面安装

YES

终端数量

228

Part Life Cycle Code

活跃

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

CERAMIC, QFP-228

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

GQFF

Package Shape

SQUARE

Package Style

FLATPACK, GUARD RING

Supply Voltage-Max

2.625 V

Supply Voltage-Min

2.375 V

Supply Voltage-Nom

2.5 V

端子位置

QUAD

终端形式

FLAT

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

S-CQFP-F228

资历状况

Qualified

温度等级

MILITARY

组织结构

1536 CLBS, 322970 GATES

座位高度-最大

3.302 mm

可编程逻辑类型

现场可编程门阵列

筛选水平

MIL-PRF-38535 Class Q

CLB-Max的组合延时

0.8 ns

逻辑块数量

1536

等效门数

322970

长度

39.37 mm

宽度

39.37 mm