AMD 8202503YA

表面安装

NO

终端数量

28

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Number of Words Code

16000

Package Body Material

CERAMIC, GLASS-SEALED

Package Equivalence Code

DIP28,.6

Operating Temperature-Min

-55 °C

Access Time-Max

200 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

8202503YA

Number of Words

16384 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.41

Part Package Code

DIP

Usage Level

Military grade

ECCN 代码

EAR99

HTS代码

8542.32.00.61

子类别

EPROMs

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

28

JESD-30代码

R-GDIP-T28

资历状况

Qualified

电源电压-最大值(Vsup)

5.5 V

电源

5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

电源电流-最大值

0.14 mA

组织结构

16KX8

输出特性

3-STATE

内存宽度

8

记忆密度

131072 bit

筛选水平

MIL-STD-883

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

UVPROM

编程电压

12.5 V