AMD AM1402APCB

表面安装

NO

终端数量

16

RoHS

Non-Compliant

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

AM1402APCB

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Max

2500000 Hz

Risk Rank

5.89

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

子类别

移位寄存器

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

4

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

温度等级

COMMERCIAL

比特数

256