AMD AM25LS174DCB

表面安装

NO

终端数量

16

Package

Tape & Box (TB)

厂商

Reliance North America

Product Status

活跃

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

AM25LS174DCB

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.92

系列

*

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

子类别

FF/Latches

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

电源

5 V

温度等级

COMMERCIAL

逻辑IC类型

JBAR-KBAR FLIP-FLOP

触发器类型

积极优势