AMD AM26LS29DM

表面安装

NO

终端数量

16

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

AM26LS29DM

Interface Standards

EIA-423; FED STD 1030

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.65

系列

*

零件状态

活跃

ECCN 代码

EAR99

HTS代码

8542.39.00.01

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-CDIP-T16

温度等级

MILITARY

座位高度-最大

5.08 mm

差分输出

NO

输入特性

STANDARD

接口IC类型

LINE DRIVER

驱动程序位数

4

电源电压1-额定值

-5 V

宽度

7.62 mm

长度

19.431 mm