AMD AM26LS32DMB

表面安装

NO

终端数量

16

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.5 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

AM26LS32DMB

Interface Standards

EIA-422; EIA-423; FED STD 1020; FED STD 1030

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Supply Voltage-Max

5.5 V

Risk Rank

5.48

ECCN 代码

EAR99

HTS代码

8542.39.00.01

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

4

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T16

温度等级

MILITARY

座位高度-最大

5.08 mm

输入特性

差动施密特触发器

接口IC类型

LINE RECEIVER

接收器位数

4

接收延迟-最大

38 ns

宽度

7.62 mm

长度

19.431 mm