AMD AM2732DMB

表面安装

NO

材料

Steel

终端数量

24

Package Description

DIP, DIP24,.6

Package Style

IN-LINE

Number of Words Code

4000

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-55 °C

Access Time-Max

450 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

AM2732DMB

Number of Words

4096 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

类型

Blind Threaded Inserts - MaxTite®

端子表面处理

Tin/Lead (Sn/Pb)

子类别

EPROMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5 V

温度等级

MILITARY

组织结构

4KX8

输出特性

3-STATE

内存宽度

8

记忆密度

32768 bit

筛选水平

MIL-STD-883 Class B (Modified)

I/O类型

COMMON

编程电压

25 V