AMD AM27S13FM

表面安装

YES

终端数量

16

Manufacturer Part Number

2SB468J

Manufacturer

Miscellaneous

Package Description

DFP, FL16,.3

Package Style

FLATPACK

Number of Words Code

512

Package Body Material

CERAMIC

Package Equivalence Code

FL16,.3

Operating Temperature-Min

-55 °C

Access Time-Max

60 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Number of Words

512 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DFP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

8.79

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

OTP ROM

技术

TTL

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

电源

5 V

温度等级

MILITARY

组织结构

512X4

内存宽度

4

记忆密度

2048 bit

筛选水平

MIL-STD-883 Class C

内存IC类型

OTP ROM