AMD AM27S181DM

表面安装

NO

终端数量

24

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

1000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

AM27S181DM

Number of Words

1024 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.2

HTS代码

8542.32.00.71

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-CDIP-T24

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

1KX8

内存宽度

8

记忆密度

8192 bit

内存IC类型

存储器电路