AMD AM2903DMB

表面安装

NO

终端数量

48

Package Description

DIP, DIP48,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP48,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

AM2903DMB

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

8.26

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Bit-Slice Processors

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T48

资历状况

不合格

温度等级

MILITARY

uPs/uCs/外围ICs类型

BIT-SLICE MICROPROCESSOR

筛选水平

MIL-STD-883 Class B (Modified)