AMD AM29C516A-1/BXC

触点镀层

50 microinches Gold Plate

安装类型

Wall - Front Mount - Thru Holes

表面安装

NO

外壳材料

不锈钢

插入材料

Hard Dielectric

终端数量

64

Contact Sizes

48#20,8#16

Service Rating

I

Insert Arrangement

J4

Contact Materials

Copper Alloy

Package Description

DIP, DIP64,.9

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP64,.9

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

AM29C516A-1/BXC

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

DSP外设

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

屏蔽/屏蔽

有

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T64

资历状况

不合格

电源

5 V

触点样式

Socket

温度等级

MILITARY

密封

Meets IP67

uPs/uCs/外围ICs类型

DSP PERIPHERAL, MULTIPLIER

筛选水平

38535Q/M;38534H;883B

外壳电镀

Passivated