AMD AM9111BPCB

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Number of Words Code

256

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP18,.3

Access Time-Max

400 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

AM9111BPCB

Number of Words

256 words

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T18

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

256X4

输出特性

3-STATE

内存宽度

4

记忆密度

1024 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM