AMD AM9112BDM-B

表面安装

NO

材料

400 series stainless steel

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Risk Rank

5.92

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Part Life Cycle Code

Obsolete

Manufacturer

AMD

Package Shape

RECTANGULAR

Package Code

DIP

Supply Voltage-Nom (Vsup)

5 V

Number of Words

256 words

Manufacturer Part Number

AM9112BDMB

Rohs Code

无

Operating Temperature-Max

125 °C

Access Time-Max

400 ns

Operating Temperature-Min

-55 °C

Package Equivalence Code

DIP16,.3

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Number of Words Code

256

Usage Level

Military grade

JESD-609代码

e0

类型

Blind Threaded Inserts - MaxTite®

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-CDIP-T16

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

256X4

输出特性

3-STATE

内存宽度

4

记忆密度

1024 bit

筛选水平

MIL-STD-883 Class B (Modified)

并行/串行

PARALLEL

内存IC类型

标准SRAM