AMD MD8080AB

表面安装

NO

终端数量

40

Package Description

DIP, DIP40,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP40,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MD8080AB

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T40

资历状况

不合格

电源

+-5,12 V

温度等级

MILITARY

速度

2 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

8

筛选水平

MIL-STD-883 Class B (Modified)