AMD Xilinx XCZU3EG-3SFVA625E

表面安装

YES

终端数量

625

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

XILINX INC

Package Description

BGA,

Moisture Sensitivity Levels

4

Operating Temperature-Max

100 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Nom

0.9 V

JESD-609代码

e1

端子表面处理

锡银铜

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

Reach合规守则

compliant

JESD-30代码

S-PBGA-B625

温度等级

OTHER

uPs/uCs/外围ICs类型

PROGRAMMABLE SoC