Amphenol DIP308-011BLF

触点镀层

Gold

房屋材料

GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER

终端数量

3

Body Orientation

Straight

Voltage, Rating

600VAC

Product Depth (mm)

Not Required(mm)

Shell Size / Insert Arrangement

9-98

Operating Temp Range

-65C to 175C

Termination Method

Crimp

Product Diameter (mm)

21.79(mm)

Mounting Styles

Cable

Rad Hardened

无

Contact Classification

3Signal

Package Description

LEAD FREE

Contact Finish Mating

GOLD (10) OVER NICKEL (50)

Body Length

0.3 inch

Rohs Code

有

Manufacturer Part Number

DIP-308-011BLF

Contact Materials

BERYLLIUM COPPER

Manufacturer

Amphenol FCi

Part Life Cycle Code

Obsolete

Ihs Manufacturer

FCI

Risk Rank

5.64

Manufacturer Series

DIP

JESD-609代码

e4

无铅代码

有

ECCN 代码

EAR99

类型

Circular

性别

PL

HTS代码

8536.69.40.40

端子间距

2.54 mm

Reach合规守则

compliant

接头数量

3(POS)

PCB接触图案

RECTANGULAR

本体宽度

0.4 inch

触点性别

PIN

本体深度

0.165 inch

触点样式

RND PIN-SKT

配套触点间距

0.1 inch

终端类型

SOLDER

端口的数量

1(Port)

PCB 触点行距

0.3 mm

触点表面处理 终端

GOLD (10) OVER NICKEL (50)

家人

D38999

设备插座类型

IC SOCKET

外壳电镀

Cadmium

使用的设备类型

DIP8

应力消除

无

产品高度(mm)

Not Required(mm)