Amphenol L717HDC62PD1CO3RC309
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L717HDC62PD1CO3RC309
143-L717HDC62PD1CO3RC309
D 形连接器
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大陆
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D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350), 62 Pin, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Without Boardlock
1最小包装量--
L717HDC62PD1CO3RC309详情
Amphenol L717HDC62PD1CO3RC309重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
触点镀层
Gold
Dimensions
29,9 x 50,8 x 4,9mm
RoHS
有
Factory Pack QuantityFactory Pack Quantity
40
Mounting Styles
Panel
Manufacturer
Amphenol
Brand
Amphenol Commercial Products
Boardlocks
Without
操作温度
-40...+85°C
系列
SM23P-300
包装
Tray
定位的数量
62 Position
行数
3 Row
性别
Male
子类别
D-Sub Connectors
触点类型
Stamped / Formed
额定电流
3 A
终端样式
通孔
注意
-
界面
SATA 3.2
产品类别
High Density D-Sub Connectors
外形尺寸
mSATA (MO-300)
安装角
直角
特征
Temp. Sensor, Core Power, DEVSLP
产品类别
D-Sub High Density Connectors
L717HDC62PD1CO3RC309拓展信息
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哦! 它是空的。