Analog Devices ADXRS622WBBGZA-RL

表面安装

YES

终端数量

32

ECCN (US)

7A994

Axis Type

Single

Typical Angular Rate Noise Density (°/s/rtHz)

0.06

Typical Angular Velocity (°/s)

±300

Shock (g)

2000

Typical Bandwidth (Hz)

2500(Max)

Minimum Operating Supply Voltage (V)

4.75

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.25

Maximum Operating Supply Current (mA)

4.5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Supplier Temperature Grade

Industrial

Standard Package Name

BGA

Supplier Package

CBGA

Mounting

表面贴装

Package Height

3.3(Max)

Package Length

6.85

Package Width

6.85

PCB changed

32

Lead Shape

Ball

Package

Bulk

厂商

Analog Devices Inc.

Product Status

Obsolete

Package Description

ROHS COMPLIANT, CERAMIC, BGA-32

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

1

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Equivalence Code

BGA32,7X7,32

Manufacturer Package Code

BG-32-3

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

105 °C

Rohs Code

无

Manufacturer Part Number

ADXRS622WBBGZA-RL

Supply Voltage-Nom (Vsup)

5 V

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Analog Devices Inc

Part Life Cycle Code

Obsolete

Samacsys Description

u00b1300u00b0/sec Yaw Rate Gyro

Ihs Manufacturer

ANALOG DEVICES INC

Risk Rank

5.05

Part Package Code

BGA

包装

卷带

系列

-

JESD-609代码

e3

无铅代码

无

零件状态

Obsolete

ECCN 代码

7A994

端子表面处理

哑光锡

HTS代码

8542.39.00.01

子类别

其他模拟集成电路

技术

BIMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

32

JESD-30代码

S-CBGA-B32

资历状况

不合格

Brand Name

Analog Devices Inc

电源电压-最大值(Vsup)

5.25 V

电源

5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

4.75 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

3.8 mm

线性

有

宽度

6.85 mm

长度

6.85 mm

RoHS状态

是,有豁免