API Delevan 10181F

表面安装

NO

终端数量

24

Manufacturer Part Number

10181F

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

DIP, DIP24,.6

Risk Rank

5.81

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP24,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

-5.2 V

温度等级

OTHER

逻辑IC类型

ARITHMETIC LOGIC UNIT