Applied Micro Circuits Corporation S3067TB

表面安装

YES

Contact plating

gold-plated

Number of pins

48

终端数量

156

Part Life Cycle Code

Obsolete

Ihs Manufacturer

APPLIED MICRO CIRCUITS CORP

Part Package Code

BGA

Package Description

LBGA,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE

Supply Voltage-Nom

3.3 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x24

Row pitch

2.54mm

Gross weight

1.68 g

Operating temperature

-40...163°C

应用

ATM;SDH;SONET

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

Current rating

1.5A

引脚数量

156

JESD-30代码

S-PBGA-B156

资历状况

不合格

温度等级

OTHER

座位高度-最大

1.65 mm

通信IC类型

ATM/SONET/SDH TRANSCEIVER

Rated voltage

60V

个人资料

beryllium copper

长度

21 mm

宽度

21 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0