Atmel GS816236BB-150

表面安装

YES

终端数量

119

Flame retardant

According to IEC/EN 60332-1-2

Permitted cable outer temperature after assembling without vibration

-40 - 90

Circuit integrity

None

Material core insulation

Polyvinyl chloride (PVC)

Conductor surface

Bare

Permitted cable outer temperature during assembling/handling

5 - 90

Core identification

Colour

Nominal cross section conductor

25

Nominal voltage U0

450

Low smoke (according to EN 61034-2)

无

Nominal voltage U

750

Conductor category

Class 5 = flexible

Package Description

BGA,

Package Style

网格排列

Moisture Sensitivity Levels

3

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

未说明

Access Time-Max

7.5 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

GS816236BB-150

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

BGA

Package Shape

RECTANGULAR

Manufacturer

GSI技术

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GSI TECHNOLOGY

Risk Rank

5.6

Part Package Code

BGA

JESD-609代码

e0

无铅代码

无

ECCN 代码

3A991.B.2.B

端子表面处理

锡铅

附加功能

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

HTS代码

8542.32.00.41

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

119

JESD-30代码

R-PBGA-B119

资历状况

不合格

电源电压-最大值(Vsup)

2.7 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

2.3 V

操作模式

SYNCHRONOUS

组织结构

512KX36

座位高度-最大

1.99 mm

内存宽度

36

记忆密度

18874368 bit

并行/串行

PARALLEL

内存IC类型

缓存SRAM

宽度

14 mm

长度

22 mm