AVX 100E331JAR3600X

终端数量

2

Product Depth (mm)

9.65(mm)

Wire Form

RIBBON LEADED

Operating Temp Range

-55C to 125C

Case Style

陶瓷芯片

Product Diameter (mm)

Not Required(mm)

Mounting Styles

表面贴装

Temp Coeff (Dielectric)

+90±30 ppm/°C

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

5%

Rad Hardened

无

Microwave Application

YES

Seated Plane Height

Not Required(mm)

包装

卷带

电容量

330PF(pF)

技术

STANDARD

结构

SMT 芯片

终端样式

AXIAL RIBBON

失败率

不需要

电压

3600VDC

产品长度(mm)

9.65(mm)

产品高度(mm)

4.32(mm)