BI Technologies BPR50510J

包装/外壳

2512

终端数量

2

Case Size

2512

Current Sensing

YES

Lead Spacing (nom)

Not Required(mm)

Package Type

SMD

Product Depth (mm)

3.1(mm)

Anti-Surge

NO

Operating Temp Range

-55C to 180C

Case Style

Molded

Product Diameter (mm)

Not Required(mm)

Temperature Range @ Derated Power

120 TO 180

Anti-Sulfurated

NO

Tolerance (+ or -)

0.5%

Power Rating(s)

1.5(W)

包装

卷带

温度系数

±100(ppm/°C)

电阻

0.056(ohm)

结构

Rectangular

军用标准

不需要

终端样式

J-Lead

失败率

不需要

产品长度(mm)

6.3(mm)

产品高度(mm)

1.9(mm)