Bourns - J.W. Miller 5330-1J
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5330-1J
337-5330-1J
集成电路(IC)
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5330-1J datasheet pdf and Integrated Circuits (ICs) product details from Bourns - J.W. Miller stock available at utmel
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5330-1J详情
Bourns - J.W. Miller 5330-1J重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
NO
终端数量
16
Manufacturer Part Number
5330-1J
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MONOLITHIC MEMORIES
Risk Rank
5.9
Access Time-Max
60 ns
Number of Words
32 words
Number of Words Code
32
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
Package Code
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Supply Voltage-Nom (Vsup)
5 V
JESD-609代码
e0
端子表面处理
Tin/Lead (Sn/Pb)
端子位置
DUAL
终端形式
THROUGH-HOLE
端子间距
2.54 mm
Reach合规守则
unknown
JESD-30代码
R-XDIP-T16
资历状况
不合格
电源
5 V
温度等级
MILITARY
电源电流-最大值
0.125 mA
组织结构
32X8
内存宽度
8
内存IC类型
OTP ROM
5330-1J拓展信息
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller
Bourns - J.W. Miller







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