Broadcom BCM4325GKFBG

表面安装

YES

终端数量

196

Manufacturer Part Number

BCM4325GKFBG

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

TFBGA,

Risk Rank

5.61

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Nom

1.25 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B196

温度等级

OTHER

座位高度-最大

1.05 mm

通信IC类型

电信电路

长度

7.5 mm

宽度

7.5 mm