Broadcom BCM4330FKFFBG

表面安装

YES

终端数量

144

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-30 °C

Supply Voltage-Nom

1.2 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

BCM4330FKFFBG

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

赛普拉斯半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Risk Rank

5.59

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

温度等级

OTHER

座位高度-最大

1 mm

通信IC类型

电信电路

宽度

6.5 mm

长度

6.5 mm