Chip Quik PA0195C

触点镀层

Gold

材料

-

房屋材料

Liquid Crystal Polymer (LCP)

接受的包装

TSSOP

Voltage, Rating

250 V

Maximum Operating Temperature

+ 105 C

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

615

Contact Materials

Copper Alloy

Manufacturer

Amphenol

Brand

Amphenol Commercial Products

Product Status

活跃

厂商

Chip Quik Inc.

Package

Bulk

RoHS

Details

For Use With

TSSOP-28 Exp Pad to DIP-28 Package

包装

Tray

系列

Proto-Advantage

尺寸/尺寸

1.400 L x 0.700 W (35.56mm x 17.78mm)

定位的数量

4 Position

行数

2 Row

子类别

Headers & Wire Housings

螺距

0.026 (0.65mm)

额定电流

6.5 A

产品类别

Headers & Wire Housings

原板类型

SMD 转 DIP

产品

Headers

产品类别

Headers & Wire Housings

板厚

-

可燃性等级

UL 94 V-0