Cornell Dubilier Electronics F25L64QA-100BG

表面安装

YES

终端数量

24

Package Description

6 X 8 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, BGA-24

Package Style

GRID ARRAY, THIN PROFILE

Number of Words Code

64000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

F25L64QA-100BG

Clock Frequency-Max (fCLK)

100 MHz

Number of Words

67108864 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

TBGA

Package Shape

RECTANGULAR

Manufacturer

Elite Semiconductor Memory Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC

Risk Rank

5.76

Part Package Code

BGA

类型

NOR型号

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

1 mm

引脚数量

24

JESD-30代码

R-PBGA-B24

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.65 V

操作模式

SYNCHRONOUS

组织结构

64MX1

座位高度-最大

1.2 mm

内存宽度

1

记忆密度

67108864 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

2.7 V

宽度

6 mm

长度

8 mm

达到SVHC

unknown