Cypress CYWB0224ABM-BVXIES

表面安装

YES

终端数量

100

Manufacturer

Fagor Automation

RoHS

Non-Compliant

Package Description

VFBGA-100

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

1.7 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

CYWB0224ABM-BVXIES

Package Code

VFBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Supply Voltage-Max

1.9 V

Risk Rank

5.62

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

JESD-30代码

S-PBGA-B100

温度等级

INDUSTRIAL

最大电源电压

3.3 V

最小电源电压

1.8 V

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1 mm

宽度

6 mm

长度

6 mm

达到SVHC

compliant