Cypress Semiconductor 5962-01-446-1391

表面安装

NO

终端数量

24

Manufacturer Part Number

5962-01-446-1391

Part Life Cycle Code

Obsolete

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

DIP, DIP24,.3

Risk Rank

5.84

Access Time-Max

45 ns

Number of Words

1024 words

Number of Words Code

1000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP24,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Usage Level

Military grade

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5 V

温度等级

MILITARY

电源电流-最大值

0.12 mA

组织结构

1KX8

内存宽度

8

待机电流-最大值

0.12 A

记忆密度

8192 bit

筛选水平

38535Q/M;38534H;883B

内存IC类型

OTP ROM