Cypress Semiconductor BCM89071A1CUBXG

表面安装

YES

终端数量

42

Package Description

WLBGA-42

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.84

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Manufacturer

赛普拉斯半导体

Package Shape

RECTANGULAR

Package Code

VFBGA

Manufacturer Part Number

BCM89071A1CUBXG

Operating Temperature-Max

85 °C

Supply Voltage-Nom

1.22 V

Operating Temperature-Min

-40 °C

Usage Level

Automotive grade

HTS代码

8542.39.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B42

温度等级

INDUSTRIAL

座位高度-最大

0.6 mm

筛选水平

AEC-Q100

通信IC类型

电信电路

宽度

2.509 mm

长度

3.019 mm