Cypress Semiconductor CY62157CV30LL-55BAI

表面安装

YES

终端数量

48

Package Description

6 X 10 MM, 1.20 MM HEIGHT, FBGA-48

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Access Time-Max

55 ns

Operating Temperature-Max

85 °C

Manufacturer Part Number

CY62157CV30LL-55BAI

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.7

Part Package Code

BGA

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.75 mm

Reach合规守则

unknown

引脚数量

48

JESD-30代码

R-PBGA-B48

资历状况

COMMERCIAL

电源电压-最大值(Vsup)

3.3 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

ASYNCHRONOUS

组织结构

512KX16

座位高度-最大

1.2 mm

记忆密度

8388608 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM

宽度

6 mm

长度

10 mm