Cypress Semiconductor CYPD4155-96BZXI

表面安装

YES

终端数量

96

Package Description

6 X 6 MM, 0.50 MM PITCH, LEAD FREE, MO-225, BGA-96

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

2.7 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

CYPD4155-96BZXI

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

赛普拉斯半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Supply Voltage-Max

5.5 V

Risk Rank

2.23

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B96

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1 mm

宽度

6 mm

长度

6 mm