Cypress Semiconductor MB9AF155MBBGL-GE1

包装/外壳

96-LFBGA

引脚数

96

供应商器件包装

96-FBGA (6x6)

ECCN (US)

EAR99

HTS

8542.32.00.51

Family Name

FM3

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

40

Maximum Clock Rate (MHz)

40

Data Bus Width (bit)

32

Programmability

有

Interface Type

I2C/UART

Number of I/Os

66

No. of Timers

2

Number of ADCs

Dual

ADC Resolution (bit)

12/12

USART

0

UART

1

I2C

1

I2S

0

Minimum Operating Supply Voltage (V)

1.65

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

BGA

Supplier Package

FBGA

Mounting

表面贴装

Package Height

0.9

Package Length

6

Package Width

6

PCB changed

96

Lead Shape

Ball

Operating Temperature (Max.)

85C

Clock Freq

40(MHz)

Operating Temperature Classification

Industrial

Package Type

FBGA

Number of Timers - General Purpose

2

Operating Temp Range

-40C to 85C

# I/Os (Max)

66

Total Internal Ram Size

48KB(kB)

Device Core Size

32(b)

Operating Supply Voltage (Max)

3.6(V)

Operating Supply Voltage (Typ)

3.3(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.65(V)

Operating Temperature (Min.)

-40C

Programmable

有

Data Converters

A/D 17x12b

Schedule B

8542320050, 8542320050/8542320050/8542320050/8542320050/8542320050

RoHS

Compliant

Memory Types

FLASH

Package Description

,

Reflow Temperature-Max (s)

未说明

Rohs Code

有

Manufacturer Part Number

MB9AF155MBBGL-GE1

Manufacturer

赛普拉斯半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Risk Rank

8.51

包装

Tray

操作温度

-40°C ~ 85°C (TA)

系列

FM3 MB9A150RB

零件状态

Obsolete

最高工作温度

85 °C

最小工作温度

-40 °C

HTS代码

8542.31.00.01

技术

CMOS

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

频率

40(MHz)

引脚数量

96

界面

EBI/EMI, I2C, SPI, UART, USART

内存大小

416 kB

振荡器类型

Internal

速度

40MHz

内存大小

48KB

电压 - 供电 (Vcc/Vdd)

1.65 V ~ 3.6 V

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

核心处理器

ARM® Cortex®-M3

周边设备

DMA, LVD, POR, PWM, WDT

程序存储器类型

Flash

芯尺寸

32-Bit

程序内存大小

384KB

连接方式

CSIO, EBI/EMI, I²C, SPI, UART/USART

核心架构

ARM

EEPROM 大小

--

以太网

0

USB

0

SPI,SPI

0

CAN

0

ADC Channels

17/17

设备核心

ARM Cortex M3

RoHS状态

符合RoHS标准