Cypress Semiconductor MB9AF156MBBGL-GE1

包装/外壳

96-LFBGA

引脚数

96

供应商器件包装

96-FBGA (6x6)

ECCN (US)

EAR99

Family Name

FM3

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

40

Maximum Clock Rate (MHz)

40

Data Bus Width (bit)

32

Programmability

有

Interface Type

I2C/UART

Number of I/Os

66

No. of Timers

2

Number of ADCs

Dual

ADC Resolution (bit)

12/12

USART

0

UART

1

I2C

1

I2S

0

Minimum Operating Supply Voltage (V)

1.65

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

BGA

Supplier Package

FBGA

Mounting

表面贴装

Package Height

0.9

Package Length

6

Package Width

6

PCB changed

96

Lead Shape

Ball

Data Converters

A/D 17x12b

Operating Temperature (Min)

-40 °C

Operating Temperature (Max)

85 °C

RoHS

Compliant

Memory Types

FLASH

Risk Rank

5.7

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Manufacturer

赛普拉斯半导体

Manufacturer Part Number

MB9AF156MBBGL-GE1

Rohs Code

有

Reflow Temperature-Max (s)

未说明

Package Description

,

包装

Tray

操作温度

-40°C ~ 85°C (TA)

系列

FM3 MB9A150RB

零件状态

Obsolete

HTS代码

8542.31.00.01

技术

CMOS

电压 - 供电

1.65 V ~ 3.6 V

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

频率

40 MHz

界面

EBI/EMI, I2C, SPI, UART, USART

内存大小

544 kB

振荡器类型

Internal

速度

40MHz

内存大小

64KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

核心处理器

ARM® Cortex®-M3

周边设备

DMA, LVD, POR, PWM, WDT

程序存储器类型

Flash

芯尺寸

32-Bit

程序内存大小

512KB

连接方式

CSIO, EBI/EMI, I²C, SPI, UART/USART

核心架构

ARM

EEPROM 大小

--

以太网

0

USB

0

SPI,SPI

0

CAN

0

ADC Channels

17/17

设备核心

ARM Cortex M3

RoHS状态

符合RoHS标准