Cypress Semiconductor WCMC2016V7B-FVI70

表面安装

YES

终端数量

48

Manufacturer Part Number

WCMC2016V7B-FVI70

Part Life Cycle Code

Obsolete

Ihs Manufacturer

WEIDA SEMICONDUCTOR INC

Package Description

FBGA, BGA48,6X8,30

Risk Rank

5.84

Access Time-Max

70 ns

Number of Words

131072 words

Number of Words Code

128000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA48,6X8,30

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

3 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.75 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B48

资历状况

不合格

电源

3 V

温度等级

OTHER

电源电流-最大值

0.015 mA

组织结构

128KX16

输出特性

3-STATE

内存宽度

16

待机电流-最大值

0.00004 A

记忆密度

2097152 bit

I/O类型

COMMON