Daily Silver Imp Microelectronics Co Ltd IMP525EMA

表面安装

YES

终端数量

8

Part Life Cycle Code

接触制造商

Ihs Manufacturer

DAILY SILVER IMP MICROELECTRONICS CO LTD

Package Description

TSSOP, TSSOP8,.19

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP8,.19

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Nom (Vsup)

1.5 V

ECCN 代码

EAR99

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G8

资历状况

不合格

温度等级

INDUSTRIAL