Daily Silver Imp Microelectronics Co Ltd IMP708SCPA

表面安装

NO

终端数量

8

Part Life Cycle Code

接触制造商

Ihs Manufacturer

DAILY SILVER IMP MICROELECTRONICS CO LTD

Package Description

DIP, DIP8,.3

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP8,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Threshold Voltage-Nom

+2.93V

ECCN 代码

EAR99

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T8

资历状况

不合格

温度等级

COMMERCIAL

可调阈值

NO

供应电流-最大值(Isup)

0.14 mA