Dale ML8202J

表面安装

NO

终端数量

24

Package Description

DIP, DIP24,.6

Risk Rank

5.92

Ihs Manufacturer

LANSDALE SEMICONDUCTOR INC

Part Life Cycle Code

Obsolete

Manufacturer

Lansdale Semiconductor Inc

Package Shape

RECTANGULAR

Package Code

DIP

Supply Voltage-Nom (Vsup)

5 V

Manufacturer Part Number

ML8202J

Rohs Code

无

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Equivalence Code

DIP24,.6

Package Body Material

CERAMIC

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

10

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5 V

温度等级

MILITARY

逻辑IC类型

D FLIP-FLOP

触发器类型

积极优势